Wafer Fabrication Equipment
| Manufacturer | Type | Model | Description | Photo | Video | Ref |
| ESEC | Die Bonder | ESEC Micron 2 | Adept Greenspring FAB-0390-1091C Board |
|
 |
IS |
| Semitool | Plating system | ECD 310 | Semitool Raider ECD 310 |
|
|
SOLD |
| TEL | Wafer Probing & Wafer Probe Testing | P8XL | TEL P8XL Prober Currently configured with Advantest Tester |
|
|
Sold |
| Disco | Wafer Grinders | DFG840 | Disco DFG840 Grinder |
|
|
Sold |
| Okamoto | Wafer Grinders | VG502-MKII 8 | Okamoto VG502-MKII 8 Grinder |
|
|
Sold |
| TSK | Wafer Probing & Wafer Probe Testing | APM90A | TSK APM90A 8 Inch Fully Automatic Wafer Prober |
|
|
IP |
| Electroglas | Wafer Probing & Wafer Probe Testing | 3001X | Electroglas 3001X 8 Inch Fully Automatic Wafer Prober |
|
|
IP |
| Ultracision | Wafer Probing & Wafer Probe Testing | 880 | Ultracision 880 8 Inch Semi Automatic Wafer Prober |
|
|
IP |
| TSK | Wafer Probing & Wafer Probe Testing | APM5000 | 5 Inch Fully Automatic Wafer Prober |
|
|
IP |
| Temptronics | Wafer Probing & Wafer Probe Testing | Temptronics Module | Temptronics Module |
|
|
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